Model

Digi XBee® 3 DigiMesh®

Digi XBee® 3 DigiMesh® PRO 

Performance

Transceiver Chipset

    Silicon Labs EFR32MG SoC

Data Rate(Software Selectable)

    RF 250 Kbps, Serial up to 1 Mbps

Indoor/Urban Range*

    Up to 60 m (200 ft)

    Up to 90 m (300 ft)

Outdoor/RF Line-Of-Sight-Range*

    Up to 1200 m (4000 ft)

    Up to 3200 m (2 miles)

Transmit Power

    +8 dBm

    +19 dBm

Receiver Sensitivity (1% Per)

    -103 dBm Normal Mode

Features

Serial Data Interface

    UART, SPI, I2C

Configuration Method

    API or AT commands, local or over-the-air (OTA)

Frequency Band

    ISM 2.4 GHz

Form Factor

    Micro, through-hole, surface mount

Interference Immunity

    DSSS (Direct Sequence Spread Spectrum)

ADC Inputs

    (4) 10-bit ADC inputs

Digital I/O

    15

Antenna Options

    Through-hole: PCB Antenna, U.FL Connector, RPSMA Connector

    MT: RF Pad, PCB Antenna, or U.FL Connector

    Micro: U.FL Antenna, RF Pad, Chip Antenna

Operating Temperature

 -40º C to 85º C (-40º F to 185º F)

Dimensions (L x W x H)

    Through-hole: 2.438 x 2.761 cm (0.960 x 1.087 in)

    SMT: 2.199 x 3.4 x 0.305 cm (0.866 x 1.33 x 0.120 in)

    Micro: 13 x 19 x 2 mm (0.533 x 0.76 x 0.087 in)

Programmability

Memory

    1 MB / 128 KB RAM

CPU/Clock Speed

    HCS08 / up to 50.33 MHz

Networking and Security

Protocol

    802.15.4

Encryption

    128/256 bit AES

Reliable Packet Delivery

    Retries/Acknowledgements

IDS

    PAN ID and addresses, cluster IDs and endpoints (optional)

Channels

    16 channels

Power Requirements

Supply Voltage

    2.1 to 3.6 V

Transmit Current

    135 mA @ 19 dBm

Receive Current

    17 mA

Power-Down Current

    2 micro Amp @ 25º C (77º F)

Regulatory Approvals

FCC, IC (North America)

    Yes

ETSI (Europe)

    Yes

    No

RCM (Australia)

    Yes

Anatel (Brazil)

    Yes

Teleck MIC (Japan)    

    Yes

    No

KCC (South Korea)    

    Yes