Model

Digi ConnectCore® 8X

Digi ConnectCore® 8X Dual

Application Processor

NXP® i.MX8QuadXPlus

• 4x Cortex®-A35 cores @ 1.2 GHz
• 1x Cortex-M4F @ 266 MHz core for real-time processing
• 1x Tensilica® Hi-Fi 4 DSP

NXP® i.MX8DualXZ

• 2x Cortex®-A35 cores @ 1.2 GHz

Memory

Up to 64 GB eMMC, up to 4 GB of LPDDR4

PMIC

NXP PF8100

Graphics

Multi-stream-capable HD video  engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 

3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders

H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 

3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders

Security

Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)

Peripherals/ Interfaces**

1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),

5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4);

8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),

4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY,

4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,

24-bit RGB, RTC, Watchdog, Timers, JTAG

1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC),

5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4);

8x I2 C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support),

4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY,

4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)*, 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI,

24-bit RGB, RTC, Watchdog, Timers, JTAG

Ethernet

2x 10/100/1000M Ethernet + AVB

Wi-Fi

802.11a/b/g/n/ac: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz

802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)

802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)

802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7

802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9

Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate.

Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct

Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready

Bluetooth

Bluetooth® 5

On-Module Microcontroller Assist

Digi Microcontroller Assist™

• Independent Cortex-M0+ microcontroller subsystem
• Supporting ultra-low power modes @ <3µA

Operating Temperature

Industrial: -40° C to 85° C (-40° F to 185° F) (depending on use case and enclosure/system design)

Storage Temperature

-50° C to 125° C (-58° F to 257° F)

Relative Humidity

5% to 90% (non-condensing)

Radio Approvals

US, Canada, EU, Japan, Australia/New Zealand

Emissions/Immunity/ Safety

FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,

FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)

Design Verification

Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78

Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT

Mechanical Dimensions

118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 5.4 mm (1.6 in x 1.8 in x 0.21 in)

Product Warranty

3-year